In the use of a large number of IC chips, we all hope to have environmental protection, anti-counterfeiting, and permanent marking of important parameters and information content. Therefore, laser marking machine is more and more widely used for IC chips.
The chip can assemble a variety of electronic components on the silicon board to form a circuit, so as to achieve a certain specific function. However, there are always some patterns, figures, etc. on the chip surface for identification or other functions. Just like this, the market needs to be able to carry out precise and detailed chip laser marking on such a small area of material, without destroying the functional attributes of the chip.
1. The overall mechanical structure of the IC laser automatic marking system is designed. The structural design is modular and reconfigurable. On the one hand, the cost of upgrading is reduced and the efficiency is improved. At the same time, the fixture can be quickly replaced to achieve flexible production of multiple varieties and small batches of IC chips.
2. Confirm the selection of laser to meet the requirements of workpiece quality and appearance. Therefore, the existing laser types shall be screened to confirm the appropriate laser type and power.
3. To ensure the accuracy of IC chip laser automatic marking, the image processing system based on mechanical positioning, combined with the digital image processing card as the core, the motion system controlled by the multi axis motion control card and the laser galvanometer scanning marking technology controlled by the DSP card can achieve the high accuracy and high speed requirements of IC chip laser marking.
4.vThe completed IC chip laser automatic marking system was jointly debugged and trial run. For different IC chip products, the control parameters were optimized to meet the equipment design requirements and IC chip laser marking accuracy requirements.
5. The control software of laser automatic marking is developed, and the visual human-machine interface is realized by using object-oriented programming method. The operation of laser, image processing system and motion control system is integrated.
It is necessary to mark permanent characters about 0.5mm in size and corporate logo on the surface of IC chip encapsulation adhesive for product identification, tracking and corporate publicity. Due to the small area of the IC and the high requirements for the accuracy of the marking position (less than 0.05mm), laser marking is suitable. At the same time, combined with electromechanical system design, it can realize flexible production of multiple varieties and small batches of IC marking. Riselaser has accumulated rich experience and technical research in numerous IC chip laser marking cases.
